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RP's hard case module design

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faithie999:
my comment about thermal conductivity was about the use of heat shrink to replace the plastic housing.  what I was getting at was whether the module might overheat if shrink wrap is used.  I know that you recommend Kapton if the housing is not used.

William Brillinger:
I would not apply heat shrink to the module. You need heat to shrink it and I recommend against that.
A very thin heat shrink material will probably not cause a thermal problem itself. I would avoid the thicker ones.

Alan:
The module is packed wall-to-wall in the case. You gain only the thickness of the case nothing more. Heat shrink wall thickness will be nearly the thickness of the case. You gain nothing or very little.

Kapton tape is very thin. At least the tape I have is. A single wrap of Kapton adds little thickness.

Plastic is a poor heat conductor. Neither the original case nor a slug of heat shrink will be any good at dissipating heat.

ON28:
Thanks for the info, I'll take it under advisement.

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